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This episode features the winners of this year’s 3D InCites Awards. These included five technology enablement awards, one sustainability award, the Adele Hars Award for DEI, and an award for Best Place to Work. 

Nils Anspach, of LPKF & Laser Electronics, explains the company’s laser-based deep etching technology for glass substrates in heterogeneous integration, and how it solves the challenges of forming interconnects through glass substrates. 

Dave Taraci, of Carl Zeiss Microscopy, explains how advanced microscopy techniques address the challenge of analyzing mixed material devices such as chiplets and heterogeneous integration packages in microelectronics. 

Ken MacWilliams, of Multibeam, addresses the challenges of chiplet communication with large interposers and high-density interconnects.

Debbie Claire Sanchez of ERS Electronic, GmbH, talks about the company’s culture steeped in diversity, equity, inclusion and belonging.

Charles Woychik, of NHanced Semiconductors, describes how Bob Patti’s leadership and culture of caring at NHanced Technology has created a positive work environment and successful company. 

Craig Bishop of Deca talks about the latest chapter of the Adaptive Patterning story. Adaptive Pad Stacks are a continuation of Adaptive Patterning, addressing misalignment issues in large-scale interposers.

Vikram Turkani, of PulseForge, discusses how ever-thinning wafers used in 3D stacking called for new solutions for temporary bond/debond processes. 

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KLA, SPTS Division
KLA provides semiconductor equipment for metrology, inspection, wafer processing, and more.

ASE Group
ASE plays a significant role in the development of the world’s most innovative electronics.

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